I. Executive Summary
1.1. Market Overview of Semiconductor Foundries Industry
1.2. Total Revenue Trends of Major IC Foundries
1.3. Advanced Process Node: Shipment Revenue & Shipment by Applications
1.4. Advanced Process Node: Production Capacity & Maker Share in 2024F
1.5. Utilization Rate Trends
1.6. Overview of Capacity Expansion & Utilization Rate Trends
1.7. Utilization Rate Trends by Each Process Node (From 40/45nm to 3nm)
1.8. IC Foundry Revenue Forecast by Process Node 2023F & 2024F
1.9. IC Foundries Including Tier2 Foundries Revenue Share 2021-2025F
1.10. Geopolitical Issues/Concerns on Semiconductor Industry
1.11. Global &China domestic Equipment companies
1.12. Manufacturing Process Procedure of Semiconductor
II. Market Overview by Advanced Process Node
2.1. Changing Major Applications Demands for Process Migration
2.2. Process Node Movement by Major Applications
2.3. Process Node Coverage by IC Foundries
2.4. Market Overview of Each Advanced Process Node
2.5. 2nm Shipment Revenue and Capacity Trends (CY2023-CY2026F)
2.6. 2nm Capacity by IC Foundry and Customers 2024F
2.7. Market Overview of 2nm Process Node
2.8. Wafer Shipment Volumes of 2nm by Applications
2.9. 3nm Shipment Revenue and Capacity Trends (CY2023-CY2026F)
2.10. 3nm Capacity by IC Foundry and Customers 2024F
2.11. Market Overview of 3nm Process Node
2.12. Wafer Shipment Volumes of 3nm by Applications
2.13. Wafer Shipment Volumes of 3nm by Customers
2.14. 3nm Process Migration Movement by Major Applications
2.15. Roadmap of Samsung Foundry Advanced Process beyond 3nm
2.16. 4/5nm Shipment Revenue and Capacity Trends (CY2023-CY2026F)
2.17. 4/5nm Capacity by IC Foundry and Customers 2024F
2.18. Market Overview of 4/5nm Process Node
2.19. Wafer Shipment Volumes of 4/5nm by Applications
2.20. Wafer Shipment Volumes of 4/5nm by Customers
2.21. AI Start-Up companies
2.22. 6/7nm Shipment Revenue and Capacity Trends (CY2023-CY2026F)
2.23. 6/7nm Capacity by IC Foundry and Customers 2024F
2.24. Market Overview of 6/7nm Process Node
2.25. Wafer Shipment Volumes of 6/7nm by Applications
2.26. Wafer Shipment Volumes of 6/7nm by Customers
2.27. 8/10nm Shipment Revenue and Capacity Trends (CY2023-CY2026F)
2.28. 8/10nm Capacity by IC Foundry and Customers 2024F
2.29. Market Overview of 8/10nm Process Node
2.30. Wafer Shipment Volumes of 8/10nm by Applications
2.31. Wafer Shipment Volumes of 8/10nm by Customers
2.32. 11/12/14/16nm Shipment Revenue and Capacity Trends (CY2023-CY2026F)
2.33. 11/12/14/16nm Capacity by IC Foundry and Customers 2024F
2.34. Market Overview of 11/12/14/16nm Process Node
2.35. Wafer Shipment Volumes of 11/12/14/16nm by Applications
2.36. Wafer Shipment Volumes of 11/12/14/16nm by Customers 1
2.37. Wafer Shipment Volumes of 11/12/14/16nm by Customers 2
2.38. Capacity Expansion Trends by Node
2.39. Major Legacy Process Node List (28nm, 40nm, 55/65nm)
2.40. Wafer Average ASP by Process Node
2.41. Japanese New Semiconductor Company: Rapidus株式会社(Rapidus Corporation) 1
2.42. Japanese New Semiconductor Company: Rapidus株式会社(Rapidus Corporation) 2
2.43. Japanese New Semiconductor Company: Rapidus株式会社(Rapidus Corporation) 3
2.44. Japanese New Semiconductor Company: Rapidus株式会社(Rapidus Corporation) 4
2.45. New Semiconductor Foundries in Japan
III. Market Topics
3.1. Back End Substrates 1
3.2. Back End Substrates 2
3.3. New Packaging Technologies by IC Foundry (TSMC & Samsung Foundry)
3.4. Types of CoWoS Packaging Technology
3.5. TSMC CoWoS Capacity Expansion Plan
3.6. Major Server/AI Related Chip Products List and Foundry
3.7. SCM of Fabless/IDM, Foundries and IC Substrates Companies
3.8. Market Trend of Chiplet Technology
3.9. Structure of Chiplet Technology
3.10. Intel Foundry “ Internal Foundnry Model”
3.11. Intel Foundry Roadmap
3.12. Intel Major Capacity Expansion Plan
3.13. Intel 2.0 Strategy Plan by Locations
3.14. FinFET (Fin Field-Effect Transistor) & GAA (Gate All Around) for Advanced Node
3.15. New Structure of Transistor：Post GAA (Gate All Around)
3.16. PPA(Power, Performance, Area) Improvements of New Process Technologies
3.17. Mask Blanks and Photo Mask Entries Makers Trends
3.18. Entry Schedule of Metal Resist
3.19. Maker Share for Total Photo Resist and EUV Resist in 2022F
3.20. JIC Acquisition of Shinko Electric Industries
3.21. Inspection of EUV Photo Mask
3.22. ASML：Forecast of EUV Shipments
3.23. Capital Expenditure Forecast by IC Foundries
IV. Individual Sheets TSMC, Samsung Foundry, SMIC, GlobalFoundries, UMC
4.1. TSMC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.2. TSMC：Production Capacity Forecast by Process Node コメント
4.3. TSMC：Wafer Revenue by Process Node
4.4. TSMC: Market Strategies & Outlook
4.5. Samsung Foundry：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.6. Samsung Foundry Production Capacity Forecast by Process Node
4.7. Samsung Foundry：Wafer Revenue by Process Node
4.8. Samsung Foundry: Market Strategies & Outlook
4.9. Intel Foundry：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.10. Intel Foundry Production Capacity Forecast by Process Node コメント
4.11. Intel Foundry：Wafer Revenue by Process Node
4.12. Intel Foundry Foundry: Market Strategies & Outlook
4.13. SMIC：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.15. SMIC：Production Capacity Forecast by Process Node
4.16. GlobalFoundries：Advanced Process Wafer Capacity & Shipment, Utilization & Yield Rate
4.17. GlobalFoundries：Production Capacity Forecast by Process Node
4.18. GlobalFoundries：Wafer Revenue by Process Node & Customers by Advanced Node
4.19. UMC：Wafer Revenue by Process Node
4.20. UMC：Production Capacity Forecast by Process Node
